Dordan blog: custom package design

Picture tour: 2014 International Consumer Electronics Show

Hello and Happy New Year my sustainable packaging friends!

Dordan to exhibit multi-media 'Design for Thermoforming' presentation at 2014 CES

Las Vegas—January 7, 2014—Dordan Manufacturing brings multi-media “Design for Thermoforming” exhibit to the 2014 International Consumer Electronics Show, booth # 70229.

PACK EXPO Exhibit Preview: Dordan's 3D Package Design Renderings

Hello my packaging and sustainability friends!