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Thermoformed electronics packaging

Custom thermoformed packaging engineered to protect electronic components throughout handling, assembly, storage, and shipment

ESD dunnage tray
ESD blister packaging

Thermoformed packaging for ESD-sensitive electronics

Dordan develops custom thermoformed trays, blisters, clamshells, and inserts that protect ESD-sensitive components throughout electronics manufacturing, automation, storage, and distribution. Packaging is engineered around component dimensions, cavity layout, part orientation, handling requirements, and material selection, with anti-static, static dissipative, conductive, and standard plastic options for electronics, semiconductor, PCB assembly, and data center applications.

Electronics packaging applications

Where ESD-sensitive packaging is used

Custom thermoformed packaging supports ESD-sensitive components throughout manufacturing, automation, storage, and distribution using trays, blisters, clamshells, and other protective packaging formats.

Integrated design, tooling, and thermoforming

Dordan combines package design, tooling development, thermoforming, and quality systems to support electronics packaging programs from development through production. Packaging is engineered using Siemens NX and manufactured in an ISO-certified facility with documented quality controls and material traceability.

  • Siemens NX package and tooling development
  • In-house prototype and production tooling
  • Anti-static, static dissipative, and conductive material options
  • ISO 9001:2015 and ISO 13485:2016 certified quality systems
  • Thermoforming, inspection, and validation support
ESD dunnage tray

Custom electronics packaging engineered for performance

Develop custom thermoformed trays, blisters, clamshells, and handling solutions designed to protect ESD-sensitive components while supporting automation, manufacturing, and distribution