Thermoformed electronics packaging
Custom thermoformed packaging engineered to protect electronic components throughout handling, assembly, storage, and shipment
Thermoformed packaging for electronics and components
Dordan develops custom thermoformed trays, blisters, clamshells, and inserts for electronics manufacturing, automation, storage, and distribution. Packaging is engineered around component dimensions, cavity layout, part orientation, handling requirements, and material performance. Standard, anti-static, static-dissipative, and conductive materials are available to support electronics, semiconductor, PCB assembly, and other component packaging applications.
Electronics packaging applications
Component Handling Trays
Custom trays support component staging, inspection, work-in-process handling, automation, and organized transport
Electronics Blister Packaging
Individual cavities protect and separate electronic components during storage, shipment, assembly, and retail presentation.
Protective Clamshell Packaging
Reclosable packaging provides protection, visibility, and secure handling for electronic components, assemblies, and accessories
Integrated design, tooling, and thermoforming
Dordan combines package design, tooling development, thermoforming, and quality systems to support electronics packaging programs from development through production. Packaging is engineered using Siemens NX and manufactured in an ISO-certified facility with documented quality controls and material traceability.
- Siemens NX package and tooling development
- In-house prototype and production tooling
- Anti-static, static dissipative, and conductive material options
- ISO 9001:2015 and ISO 13485:2016 certified quality systems
- Thermoforming, inspection, and validation support
Start your electronics packaging project
Custom thermoformed trays and packaging engineered to protect electronic components, improve material handling, and support efficient manufacturing and assembly