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Thermoformed electronics packaging

Custom thermoformed packaging engineered to protect electronic components throughout handling, assembly, storage, and shipment

ESD dunnage tray
ESD blister packaging

Thermoformed packaging for electronics and components

Dordan develops custom thermoformed trays, blisters, clamshells, and inserts for electronics manufacturing, automation, storage, and distribution. Packaging is engineered around component dimensions, cavity layout, part orientation, handling requirements, and material performance. Standard, anti-static, static-dissipative, and conductive materials are available to support electronics, semiconductor, PCB assembly, and other component packaging applications.

Electronics packaging applications

Where electronics packaging is used
Custom thermoformed packaging supports electronic components and assemblies throughout manufacturing, automation, storage, and distribution. Packaging can be produced in standard or ESD materials depending on product sensitivity and handling requirements.

Integrated design, tooling, and thermoforming

Dordan combines package design, tooling development, thermoforming, and quality systems to support electronics packaging programs from development through production. Packaging is engineered using Siemens NX and manufactured in an ISO-certified facility with documented quality controls and material traceability.

  • Siemens NX package and tooling development
  • In-house prototype and production tooling
  • Anti-static, static dissipative, and conductive material options
  • ISO 9001:2015 and ISO 13485:2016 certified quality systems
  • Thermoforming, inspection, and validation support
ESD dunnage tray

Start your electronics packaging project

Custom thermoformed trays and packaging engineered to protect electronic components, improve material handling, and support efficient manufacturing and assembly